1·Equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
2·Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
3·Do not use the other metal components contact solder paste.
勿使用其它金属成份接触锡膏。
4·Is the sequence of Solder Paste height measurements defined?
锡膏厚度的测量顺序是否指定？
5·Is the storage fridge temperature of Solder Paste controlled?
是否对存放焊膏的电冰箱温度进行控制？
6·The use of nitrogen will depend on the solder paste flux chemistry.
是否使用氮气取决于焊锡膏焊剂的化学特性。
7·This product is no-clean solder paste, very little residue, no cleaning.
本产品是免清洗焊膏，几乎无残留，无需清洗。
8·Use only with production equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
9·So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
10·A solder paste used for brazing was developed and its technical performance was investigated.
研制了铝硬钎焊用钎料膏，对其工艺性能进行了研究。